To support the latest wafer processes involving increased density, multiple layers, and progressively higher steps, this type enables various macro inspection functions including transport (micro inspection), pattern-side macro inspection, back-side center and periphery macro inspections. Users can select from three models-TMB, TM, and T-according to their needs. These models offer a variety of features, including non-contact centering controlled by photoelectric sensor to prevent contamination; a large, easy-to-read LCD control panel; and high throughput made possible by a multi-arm system that simplifies wafer loading and unloading; and support for both 150mm and 200mm?wafers.
(The photo shows an example of a wafer loader combined with an ECLIPSE L200 IC inspection microscope.)

The following features are added to enhance the macro functions of the TMB series:
Stainless-steel body generates no static electricity
Provided with an emergency stop switch (EMO)
Vacuum chuck unit uses PEEK plastic so that the checked wafer is hardly scratched.
Data communication function (optional) conforming to SEMI (SECS) standards
(Photo is an example configured with the ECLIPSE L200 IC inspection microscope)

An upgraded version of the NWL860TMB-SP/MB-SP, this model comes with an SMF elevator.
(Photo is an example configured with the ECLIPSE L200 IC inspection microscope)

*Dedicated macro inspection system capable of performing Pattern Side Macro, Back Side Periphery Macro, and Center Macro inspections